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Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bondin
Il-Woong Suh Hoon-Sun Jung Young-Ho Lee Sung-Hoon Choa
Vol. 16, No. 5, pp. 1843-1850, Sep. 2016
10.6113/JPE.2016.16.5.1843
Vol. 16, No. 5, pp. 1843-1850, Sep. 2016
10.6113/JPE.2016.16.5.1843
ISSN : 1598 - 2092
eISSN : 2093 - 4718